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Abstract

The portable electronic devices in everyday life have been getting increasingly compact day by day, and with the advancement in wireless technology, they are expected to facilitate multitasking. In this context, efficient heat dissipation to maintain consistent thermal performance has become quite a challenge. Phase change materials (PCMs) have emerged as a viable option to eliminate problems regarding the thermal management of compact electronics. This review looks into the different types of PCMs investigated by researchers so far, especially in the case of cooling compact electronic devices. It also discusses the parameters critical to its efficiency and implementation, encapsulation, etc. The merit of internal fins, nanomaterials, and metal foams as thermal conductivity enhancers along with shortcomings in the current literature have also been noted in this review.

Keywords

Phase change materials Passive cooling microencapsulation Thermal conductivity enhancers Internal fins nanoparticles

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Khan, Z. (2022). A review of phase change materials (PCMs) in electronic device cooling applications. Future Technology, 1(2), 36–45. Retrieved from https://fupubco.com/futech/article/view/36
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